Wevision for Electronics
AI precision for
defect-free electronics
AI precision for
defect-free electronics
Advanced vision systems engineered for micro-scale accuracy, ensuring flawless SMT production and eliminating field-failure risks at the source.
We care about you
We work with the best
Your business, our eyes
PROBLEM
PROBLEM
Where Our Customers Need the Most Support
Where Our Customers Need the Most Support
PCB Surface Abnormalities
Warping, micro-cracks, delamination, and uneven solder mask patterns often escape standard AOI and human inspection.
PCB Surface Abnormalities
Warping, micro-cracks, delamination, and uneven solder mask patterns often escape standard AOI and human inspection.
Component Misalignment
Even slight X/Y offset, rotation, or tilt of ICs, resistors, or connectors leads to reflow issues, open circuits, EMI problems, and cosmetic rejects.
Component Misalignment
Even slight X/Y offset, rotation, or tilt of ICs, resistors, or connectors leads to reflow issues, open circuits, EMI problems, and cosmetic rejects.
Solder Splatter / Solder Balling
Stray solder balls or micro-splatter frequently cause short circuits and intermittent failures — often invisible until after assembly.
Solder Splatter / Solder Balling
Stray solder balls or micro-splatter frequently cause short circuits and intermittent failures — often invisible until after assembly.
WHAT WE OFFER
WHAT WE OFFER
[02]
[02]
Solutions
Solutions
Solutions
©2025
©2025
Our technology inspects electronics assemblies using high-speed, multi-angle, multi-spectrum vision pipelines and applies pixel-level AI models to detect micro-variations that traditional AOI and manual inspection miss.
Our technology inspects electronics assemblies using high-speed, multi-angle, multi-spectrum vision pipelines and applies pixel-level AI models to detect micro-variations that traditional AOI and manual inspection miss.
1
Multi-Spectrum Surface Profilometry Engine
We use synchronized RGB, NIR, and structured light for detailed PCB views. AI optical-flow detects micro-cracks, solder-mask flaws, and warping, with sub-micron scoring for high-confidence defect ID.
Sub-10µm depth resolution
Multi-angle reflectance mapping
Surface topology reconstruction
1
Multi-Spectrum Surface Profilometry Engine
We use synchronized RGB, NIR, and structured light for detailed PCB views. AI optical-flow detects micro-cracks, solder-mask flaws, and warping, with sub-micron scoring for high-confidence defect ID.
Sub-10µm depth resolution
Multi-angle reflectance mapping
Surface topology reconstruction
2
Pixel-Level Geometric Alignment Analysis
Fine-pitch parts are analyzed with high-magnification imaging and geometric deep learning. AI tracks X/Y shift, rotation, Z-tilt, and pin alignment, with tolerances auto-adjusting per component.
0.01° rotational accuracy
Fiducial-less auto-alignment
Deep Learning feature matching
2
Pixel-Level Geometric Alignment Analysis
Fine-pitch parts are analyzed with high-magnification imaging and geometric deep learning. AI tracks X/Y shift, rotation, Z-tilt, and pin alignment, with tolerances auto-adjusting per component.
0.01° rotational accuracy
Fiducial-less auto-alignment
Deep Learning feature matching
3
Solder-joint thermal & reflectance anomalies
Thermal modeling and micro-reflective imaging reveal solder balls, splatter, bridges, and incomplete joints. AI flags abnormal heat and reflectance patterns, catching micro-contaminants beyond human visibility.
Thermal + optical analysis
Micro-solder particle detection
Reflectance anomaly scoring
3
Solder-joint thermal & reflectance anomalies
Thermal modeling and micro-reflective imaging reveal solder balls, splatter, bridges, and incomplete joints. AI flags abnormal heat and reflectance patterns, catching micro-contaminants beyond human visibility.
Thermal + optical analysis
Micro-solder particle detection
Reflectance anomaly scoring
IMPACT
IMPACT
Rooted in precision, we rely on measurable results.
Rooted in precision, we rely on measurable results.
99.95%
Accuracy
Pixel-level defect detection using multi-spectrum and geometric-AI pipelines.
99.95%
Accuracy
Pixel-level defect detection using multi-spectrum and geometric-AI pipelines.
16,500+
Images per Second
Real-time, high-speed inspection that eliminates quality bottlenecks and increases throughput instantly.
16,500+
Images per Second
We support founders to make their mark
16,500+
Images per Second
Real-time, high-speed inspection that eliminates quality bottlenecks and increases throughput instantly.
22+
Areas Covered
SMT assembly, PCB surface inspection, IC packaging, connector analysis, conformal coating, solder joint evaluation, and more.
22+
Areas Covered
SMT assembly, PCB surface inspection, IC packaging, connector analysis, conformal coating, solder joint evaluation, and more.
Engineer your line for zero-defect electronics
See how multi-spectrum vision, geometric AI, and hybrid solder analysis eliminate micro-defects before they reach your customers.
Schedule a Demo
Engineer your line for zero-defect electronics
See how multi-spectrum vision, geometric AI, and hybrid solder analysis eliminate micro-defects before they reach your customers.
Schedule a Demo
Engineer your line for zero-defect electronics
See how multi-spectrum vision, geometric AI, and hybrid solder analysis eliminate micro-defects before they reach your customers.
Schedule a Demo